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Studio-edited photograph of the manufactured Agronomics enclosure on white, showing its printed texture, green gasket and connectors.

Smart Soil Sensor

An enclosure for Agronomics’ soil-sensor board, with a snap-lock lid, TPU gaskets and USB-C access. We refined the FDM-printed housing across production batches.

Project stage
Manufactured parts
Work type
Client project

Sealed for the field

  • Exploded render: the housing lid, a green TPU gasket, the USB-C connector, the sensor circuit board and the black housing with its debossed logo.

Agronomics needed a field enclosure around its soil-sensor board. Our work focused on the housing, access to the connector and screw-free assembly.

We designed the housing around the sensor board: a lid with a snap-lock mechanism, TPU gaskets at the enclosure joints, a USB-C connector and a debossed logo. It assembles without screws and is optimised for FDM printing.

We refined the housing against Agronomics’ ingress requirements from one production batch to the next. This page does not claim a certified IP rating.

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